Today, the most common form of mass-production semiconductor device fabrication is CMOS … See more

CMOS-MEMS fabrication process
The CMOS-MEMS process used in this work uses the back-end-of-line (BEOL) of a standard 6-metal 0.18 μm CMOS process to build the … See more

Characterization Maximum working temperature. Closed cavity
A QFN z device (600 μm-long beams with 0.5 μm gap) was put inside an oven and heated up f… See more

Integration of MEMS on CMOS using the BEOL layers is a long-sought objective that would provide significant size, cost, speed and power advantages in some application… See more

The authors would like to thank Laura Barrachina and Sandra Aguilar from Baolab Microsystems for assistance during the measurements. This work was supported by Baolab … See more